Introduction to manufacturing process:
PI material is injected into the module surface to protect the module from collision and scratches or water and gas intrusion.
Common problem:
The filling of PI material can produce a large number of bubbles in the interior or surface. These bubbles not only affect the appearance of the appearance, but also cause the product reliability
Problem solving application:
When the PI material is filled, the bubble can be eliminate by applying pressure and heating baking to the product in the cavity.
PI Material
Tg : >300c
Test Equipment
Other Oven & ELT High tempreature vacuum Oven
Test Result:
ELT PI shows no void after pressurized curing.
X-section also shows no void
