Products

Vacuum Perssure System

The vacuum pressure system is used to remove air bubble or gas which trapped inside the package during the lamination process of various materials such as films, underfilling or encapsulation… etc. Through his process to enhance adhesive strength and reliability.

Wafer Vacuum Laminator

Good lamination filling capability for uneven surface topography, such as high-aspect ratio via filling, bumps space filling and chips molding.

News

02July2019

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Application

Semiconductors

Major Business in Semiconductors, optoelectronics, display , automotive and industry sectors...

Optoelectronics

Based on our close cooperation with customers, we are confident to become the premium de-void / lamination solution partner to enable future needs.

Automotive

All the key founders are very experienced over 20 years. We wish to become a worldwide leading company and keeping service the industry.

  • ADD:No.5-1, Ln.152, Baozhong Rd., Xinpu Township, Hsinchu County 305,Taiwan(R.O.C.)
  • TEL:+886-3-5880020
  • FAX:+886-3-5880780
  • EMAIL:sales@eleadtk.com