The ELT vacuum pressure system breaks the bottleneck of traditional technology, adopts innovative invention patent technology, which uses the mode of vacuum + pressure interactive switching to eliminate the void problem. It can effectively remove the bubbles produced in die attached, potting, underfill…
The ELT Wafer Vacuum Laminator is different from the traditional roller type machine. It is innovative to attach dry film under vacuum and develop the heating air bag laminating. Vacuum / pressure / temperature & time can be independently set up in accordance with material application, and the secondary surface leveling and laminating can…
Advanced semiconductor packaging process
Die Attached,NCF
Underfill, dry film
Electronic assembly process ,
PCB potting, MEMS products
lamination and de-void
We also provide solutions for any other Industries that need to eliminate bubbles
Eleadtk established in 2015.Major Business in Semiconductors, optoelectronics, display , automotive and industry sectors. Based on our close cooperation with customers, we are confident to become the premium de-void / lamination solution partner to enable future needs.
LEARN MORE>>ELT was founded in 2015, focusing on bubble eliminate process and lamination technology.
The customer base covers semiconductor, photoelectric, display, automobile, traditional industries and other fields.
