應用實例

應用實例

真空壓力除泡系統

晶粒黏著(Die Attached),
灌注封膠(potting),
底部填膠(Underfill),
晶圓壓膜貼附(Iamination)...

真空壓膜機應用實例

3D-IC / TSV Package-TSV filling by polymer lamination
Embedded Wafer Level Package- groove filling by dielectric material lamination