產品介紹

產品介紹

真空壓力除泡系統

The vacuum pressure system is used to remove air bubble or gas which trapped inside the package during the lamination process of various materials such as films, underfilling or encapsulation… etc. Through his process to enhance adhesive st

晶圓級真空壓膜機

Good lamination filling capability for uneven surface topography, such as high-aspect ratio via filling, bumps space filling and chips molding.