產品介紹

真空壓力除泡系統

產品特色

  • 真空+壓力除泡, 實現大氣泡去除
  • 大幅提高UPH
  • 高品質/高信賴性
  • 多樣性工藝/材料應用
  • 高速昇温/冷却大幅短縮製程時間
  • 低含氧量自動控制/紀錄
  • 降低揮發物汙染設計

產品應用

  • 晶片黏著(Die attached)
  • 灌注封膠(Potting)
  • 塗佈/塗層(Printing)
  • 底部填膠 (Underfill)
  • 光學膜貼合/晶圓壓膜貼附(Lamination)

產品規格

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備註

The vacuum pressure system is used to remove air bubble or gas which trapped inside the package during the lamination process of various materials such as films, underfilling or encapsulation… etc. Through his process to enhance adhesive strength and reliability.