The vacuum pressure system is used to remove air bubble or gas which trapped inside the package during the lamination process of various materials such as films, underfilling or encapsulation… etc. Through his process to enhance adhesive strength and reliability.
Major Business in Semiconductors, optoelectronics, display , automotive and industry sectors...
Based on our close cooperation with customers, we are confident to become the premium de-void / lamination solution partner to enable future needs.
All the key founders are very experienced over 20 years. We wish to become a worldwide leading company and keeping service the industry.