產品介紹

真空壓力除泡系統

The vacuum pressure system is used to remove air bubble or gas which trapped inside the package during the lamination process of various materials such as films, underfilling or encapsulation… etc. Through his process to enhance adhesive strength and reliability.

晶圓級真空壓膜機

Good lamination filling capability for uneven surface topography, such as high-aspect ratio via filling, bumps space filling and chips molding.

最新消息

21May2018

毅力科技有限公司

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產品應用

Semiconductors

Major Business in Semiconductors, optoelectronics, display , automotive and industry sectors...

Optoelectronics

Based on our close cooperation with customers, we are confident to become the premium de-void / lamination solution partner to enable future needs.

Automotive

All the key founders are very experienced over 20 years. We wish to become a worldwide leading company and keeping service the industry.